Device: HYC0SEG0MF1 [FBGA149]
Manufacturer: Hynix
Part number description for this device:
Move the cursor over the box to highlight particular section| HY | Hynix Memory | |
| X | Product Group | A = NAND B = NAND+NAND C = NAND+mobile SDRAM D = NAND+mobile DDR E = NAND+NAND+mobile SDRAM F = NAND+NAND+mobile DDR G = NAND+mobile SDRAM+mobile SDRAM H = NAND+LP DDR+LP DDR I = NAND+NAND+mobile SD+mobile SD |
| X | Small Classification | 0None 1 = Pseudo SRAM 2 = Pseudo SRAM+pseudo SRAM 3 = SRAM 4 = SRAM+SRAM 5 = Pseudo SRAM+SRAM 6 = Pseudo+Pseudo+SRAM 7 = Pseudo+SRAM+SRAM |
| X | Vcc (Flash / RAM) | V = 2.7V / 2.7V U = 2.7V / 1.8V L = 1.8V / 2.7V S = 1.8V / 1.8V |
| X | Flash Density | A = 16Mx8 B = 8Mx16 C = 32Mx8 D = 16Mx16 E = 64Mx8 F = 32Mx16 G = 128Mx8 H = 64Mx16 I = 256Mx8 J = 128Mx16 |
| X | DRAM Density | 0None A = 4Mx16 B = 2Mx32 C = 8Mx16 D = 4Mx32 E = 16Mx8 F = 8Mx32 G = 32Mx16 H = 16Mx32 I = 64Mx16 J = 32Mx32 |
| X | Pseudo / SRAM Density | 0None A = 512Kx16 B = 256Kx32 C = 1Mx16 D = 512Kx32 E = 2Mx16 F = 1Mx32 G = 4Mx16 H = 2Mx32 I = 8Mx16 J = 4Mx32 K = 16Mx16 L = 8Mx32 |
| X | Generation | M = 1st generation A = 2nd generation B = 3rd generation C = 4th generation |
| X | Package Type | F = FBGA |
| X | Customer Option | 1 = FBGA 149 ball 2 = FBGA 107 ball 3 = FBGA 137 ball |
| X | Package Material | Blank = Normal P = Lead free |
| X | NAND Flash Speed | 5 = 50ns 6 = 60ns 8 = 80ns |
| X | NAND Flash Mode | S = 512 Byte Page Buffer L = 2K Byte Page Buffer |
| X | Mobile SDR / DDR Speed | 0None S = 105MHz / DDR200@CL3 P = 105MHz / DDR200@CL2 H = 133MHz / DDR266@CL3 B = 66MHz@CL2 |
| X | Pseudo SRAM SPeed | 0None L = 80ns F = 70ns V = 60ns U = 55ns A = 66MHz@CL4 C = 104MHz@CL4 D = 108MHz@CL4 E = 133MHz@CL4 |
| X | Temparature Range | C = 0°C to 70°C E = -30°C to 85°C I = -40°C to 85°C |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
| BeeHive204 | adapter/module: BGA-0875/0874 (70-0875/0874) = BGA-Bottom-95 (70-0875) + BGA-Top-147 ZIF-CS (70-0874) |
| BeeHive208S | adapter/module: BGA-0875/0874 (70-0875/0874) = BGA-Bottom-95 (70-0875) + BGA-Top-147 ZIF-CS (70-0874) |
| BeeProg2 | adapter/module: BGA-0875/0874 (70-0875/0874) = BGA-Bottom-95 (70-0875) + BGA-Top-147 ZIF-CS (70-0874) |
| BeeProg2C | adapter/module: BGA-0875/0874 (70-0875/0874) = BGA-Bottom-95 (70-0875) + BGA-Top-147 ZIF-CS (70-0874) |
